To reduce punch sticking while tableting amino acid tablets, there are several strategies that can be employed. Punch sticking, also known as tablet adhesion to the die wall, is a common issue in the tableting process [3].

Firstly, it is crucial to maintain appropriate levels of humidity during the tableting process. Excessive moisture can lead to increased tablet adhesion to the punch and die wall [3]. Implementing a drying step before the tableting process can help reduce the moisture content of the amino acid powder [1].

Lubrication is another critical factor in reducing punch sticking. The use of lubricants, such as magnesium stearate, can significantly decrease the friction between the tablet and the punch and die wall [2][3]. However, it is essential to optimize the amount of lubricant used, as too much can lead to issues such as poor content uniformity and weak tablets [2].

The particle size of the amino acid powder can also impact punch sticking. Finer particle sizes can lead to increased surface area, which can result in greater adhesion to the punch and die wall [3]. Therefore, it may be beneficial to use larger particle sizes or modify the particle size distribution of the amino acid powder [1].

Lastly, the tableting process parameters, such as compression force and speed, can affect punch sticking [3]. Optimizing these parameters can help reduce tablet adhesion. For instance, increasing the compression force can decrease the porosity of the tablet, which can reduce the surface area available for adhesion [3].

In summary, reducing punch sticking while tableting amino acid tablets can be achieved through controlling humidity, optimizing lubrication, modifying particle size, and adjusting tableting process parameters.

Sources:
[1] <https://www.drugpatentwatch.com/p/tradename/AMINO>
[2] <https://www.tabletscapsules.com/3641-Technical-Articles/587909-Tableting-The-Science-Behind-Sticking-and-How-to-Resolve-It/>
[3] <https://www.sciencedirect.com/science/article/abs/pii/S0378517323004611>